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| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon E3-1200 v2 |
| Model number | E3-1275 v2 |
| CPU part numbers | CM8063701098702 is an OEM/tray microprocessor BX80637E31275V2 is a boxed microprocessor |
| Frequency | 3500 MHz |
| Turbo frequency | 3900 MHz |
| Bus speed | 5 GT/s DMI |
| Clock multiplier | 35 |
| Package | 1155-land Flip-Chip Land Grid Array (FCLGA 1155) |
| Socket | Socket 1155 (Socket H2) |
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
| Architecture / Microarchitecture | |
| Microarchitecture | Ivy Bridge |
| Platform | Carlow |
| Processor core | Ivy Bridge-H2 |
| Core stepping | E1 (SR0PA) |
| CPUID | 306A9 (SR0PA) |
| Manufacturing process | 0.022 micron High-K metal gate process |
| Data width | 64 bit |
| The number of cores | 4 |
| The number of threads | 8 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 4 x 32 KB instruction cache 4 x 32 KB data cache |
| Level 2 cache size | 4 x 256 KB |
| Level 3 cache size | 8 MB |
| Physical memory | 32 GB |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features | Enhanced SpeedStep technology |
| On-chip peripherals |
|
| Electrical/Thermal parameters | |
| Thermal Design Power | 77 Watt |
| Notes on Intel CM8063701098702 | |
| |
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